TS-3300
DIPSOL TS-3300 is jet stream type, Pb-free, Sn-Ag alloy plating bath.
This process will deposit stable and bright alloy plating at the Ag co-deposition
ratio of 3.5wt%, and it is effective substitute for conventional Tin-Lead Alloy
(Solder) plating.
This process will deposit stable and bright alloy plating at the Ag co-deposition
ratio of 3.5wt%, and it is effective substitute for conventional Tin-Lead Alloy
(Solder) plating.
Applications | Jet Stream Type Plating |
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Features | ●Ag 3.5% co-deposition ratio could be obtained stably and best for the replacement of Sn-Pb plating. ●Desired uniform Ag deposition ratio and appearance deposit could be obtained in wide current density range. ●Excellent leveling, ideal for soldering. ●Prevents whisker formation. ●Free of cyanide, fluoride/stable bath. ●Waste water treatment done by simple neutralization process. |
Parameters | Temperature 23~27°C Current Density 30~80A/dm2 |
商品名 | 法規情報 | 荷姿 |
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関連法規に関する記号
劇物(毒物及び劇物取締法) 労働安全衛生法 りん含有製品 チッ素含有製品 危険物(消防法)