TS-3200
DIPSOL TS-3200 is Pb-free, Sn-Ag alloy plating process that is suitable for plating
system of continuous carrying type and hoop type.
This process will deposit stable and semi-bright alloy plating at the Ag co-deposition
ratio of 3.5wt%, and it is effective substitute for conventional Tin-Lead Alloy (Solder) plating.
劇物（毒物及び劇物取締法）
労働安全衛生法
りん含有製品
チッ素含有製品
危険物（消防法）
system of continuous carrying type and hoop type.
This process will deposit stable and semi-bright alloy plating at the Ag co-deposition
ratio of 3.5wt%, and it is effective substitute for conventional Tin-Lead Alloy (Solder) plating.
| Applications | Leadframes Connectors |
|---|---|
| Features | - Ag 3.5% co-deposition ratio could be obtained stably and best for the replacement of Sn-Pb plating. - Desired uniform Ag deposition ratio and appearance deposit could be obtained in wide current density range. - Excellent leveling, ideal for soldering. - Prevents whisker formation. - Free of cyanide, fluoride/stable bath. - Waste water treatment done by simple neutralization process. |
| Parameters | Temperature 22～28°C Current Density 10～30A/dm2 |
| 商品名 | 法規情報 | 荷姿 |
|---|
関連法規に関する記号
劇物（毒物及び劇物取締法）
労働安全衛生法
りん含有製品
チッ素含有製品
危険物（消防法）
